![]() ![]() ![]() For this reason, Indium Corporation has introduced a new ultra-low (ULR) flux called NC-26-A for both current and emerging applications. This could be another long thread LOL Post Reply Re: Flux with Tin or Not Author: Dunbar (KY) That tinning flux spreads real easy and solder flows quicker. In these circumstances, a move towards an ultra-low residue no-clean flux is inevitable, although new failure modes continue to appear, being driven by the smaller dimensions. Ten thousand plumblers will chime in with soldering advice. This failure mode is believed to be driven by a combination of: very small diameter microbumps the move from hemispherical to very thin solder microbumps on copper pillar (reduced joint compliance) and low CTE, low-cost, and low layer count (thinned) substrates. Aqueous (water-based) cleaning becomes more complex with fine pitch flip-chip attach as it becomes increasingly difficult to get the cleaning solution under the chip to dissolve the residues, and then to carry the residue-containing solution out from under the chip.Ī recent emerging failure mode caused by cleaning involves solder joint damage during aqueous jet impingement. However, copper pillar heights of 40-60 microns (and even shorter than this in the near future) combined with fine pitch, makes cleaning extremely complex. The use of copper pillar instead of solder bumps has meant that chip-substrate clearances and finer pitches do not necessarily move in lock-step with each other. ![]() Water-soluble fluxes, which may be applied by dipping or spraying, have long been used in flip-chip assembly, but their long history of utility is coming to a close as a number of factors makes the move to no-clean inevitable in the high-volume sub-130micron copper pillar era. Indium Corporation's ball-attach fluxes, such as WS-446HF, WS-823, and WS-829, were formulated to not only prevent these failures, but to eliminate some of the process steps which could cause these failures in the first place. However, the soldering steps are complex and can lead to problematic failures. The BGA ball-mount process may seem uninteresting and trivial at first glance. Learn more in the upcoming SiP Printing 101 Webinar! Read More Common Ball Grid Array Failures and How to Avoid Them Indium Corporation's SiPaste ® solder pastes offer a complete portfolio of pastes to choose from to fit many assembly processes. No-Clean PastesĬhoosing the correct solder paste formulation is critical for System-in-Package assembly. Read More SiP Printing 101 Webinar Preview: Water Soluble vs. Just as important in the solder paste printing process is solder paste inspection how do you know if your printer is operating optimally if your SPI machine is not doing the same? Learn more in my upcoming SiP Printing 101 Webinar. Learn more at my upcoming SiP Printing 101 Webinar! Read More SiP Printing 101 Webinar Preview: Solder Paste Inspection Stencil technology has evolved throughout the years, and System-in-Package solder pastes require specific stencil manufacturing processes and novel technology to achieve great transfer efficiency. Where has the semiconductor team been traveling to this summer? Read More SiP Printing 101 Webinar Preview: Stencil Technology SiP & Heterogeneous Integration & Assembly (HIA)Ĭlose Related Flip-Chip Flux Blog Articles Trade Show Travels June 2022.The Indium Corporation & Macartney Family Foundation. ![]()
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